AGFB027R31C2E4XC: Intel® Agilex™ 7 FPGA SoC for High-Performance Computing

AGFB027R31C2E4XC Product Overview

The AGFB027R31C2E4XC is an advanced System-on-Chip (SoC) based on the Intel® Agilex™ 7 FPGA series, specifically designed for embedded computing and digital signal processing applications that require high performance, high bandwidth, and low power consumption. This chip integrates an FPGA architecture with 2.7 million logic elements and a hard processor system with quad-core ARM® Cortex®-A53, utilizing advanced 10-nanometer SuperFin process technology to achieve the optimal balance between performance and power efficiency. It is an ideal solution for fields such as communication infrastructure, military aviation, industrial automation, and high-end test and measurement.

Compared to traditional FPGAs, the AGFB027R31C2E4XC delivers an average 50% higher fabric performance while reducing total power consumption by 40%, providing customers with significant system-level advantages.

AGFB027R31C2E4XC Core Features & Advantages

Powerful Processing Capability

High-Performance FPGA Architecture: Equipped with 2,692,760 Logic Elements (LEs) and 912,800 Adaptive Logic Modules (ALMs), offering exceptional programmable logic resources.

Quad-Core ARM Cortex-A53 Processor: Operating at speeds up to 1.4GHz, supporting MPCore™ with CoreSight™, ARM NEON, and floating-point operations for efficient software execution.

Abundant DSP Resources: Integrates 8,528 DSP blocks, supporting various digital signal processing formats including fixed-point (hard IP), floating-point (hard IP), multiplication, and multiply-accumulate.

High-Speed Connectivity & Interfaces

High-Speed Transceiver System: Supports data rates up to 58 Gbps PAM4 and 32 Gbps NRZ, meeting the most demanding bandwidth requirements.

Extensive Protocol Support: Integrated hard IP supports advanced communication protocols like PCIe Gen4 and 10/25/50/100/200/400G Ethernet.

Versatile I/O Capabilities: Provides up to 720 user I/Os, supporting various I/O standards such as LVCMOS, SSTL, POD, and HSTL.

Efficient Memory Subsystem

On-Chip Memory Integration: Offers up to 287Mb of embedded memory resources.

Hard Memory Controller: Supports external memory interfaces like DDR4 and QDR IV, enabling efficient data storage and access.

Processor-Dedicated Memory: Includes 256KB RAM, ensuring the efficient operation of the processor system.

AGFB027R31C2E4XC Detailed Technical Specifications

AGFB027R31C2E4XC Application Fields

The AGFB027R31C2E4XC is suitable for various high-performance application scenarios:

Communication Infrastructure: 5G base stations, network function virtualization, high-speed routers and switches.

Military & Aerospace: Radar systems, electronic warfare, signals intelligence (SIGINT), and communication systems.

Industrial Automation: Machine vision, real-time control systems, predictive maintenance.

Medical & Test Equipment: High-end medical imaging, scientific instruments, test and measurement equipment.

Broadcast & Professional AV: Real-time video processing, broadcast infrastructure, immersive media production.

Why Choose AGFB027R31C2E4XC?

The AGFB027R31C2E4XC represents the leading edge of FPGA technology, combining Intel's advanced 10-nanometer SuperFin process with the innovative second-generation Intel Hyperflex™ FPGA architecture. This chip not only delivers exceptional performance and power efficiency but also significantly simplifies system design and shortens time-to-market through the perfect integration of the hard processor system and programmable logic.

Its enhanced system integration and power reduction technologies like power islands and power gating enable customers to achieve higher performance levels within smaller form factors and with lower power consumption. Whether used for upgrading existing systems or for new designs, the AGFB027R31C2E4XC provides the necessary flexibility, performance, and power efficiency to help customers maintain a competitive edge in a rapidly changing market.