AGFC019R25A3I3E - Intel Agilex™ 7 FPGA: The Ideal Choice for High-Performance Computing and AI Applications

AGFC019R25A3I3E Product Overview

The AGFC019R25A3I3E is a high-performance System-on-Chip (SoC) from Intel's Agilex™ 7 F-Series FPGAs. Built with advanced 10nm SuperFin process technology, it integrates 1.918 million logic elements and a quad-core ARM Cortex-A53 hard processor system, delivering exceptional processing power and energy efficiency for demanding compute-intensive applications.

This FPGA is particularly suited for applications requiring a balance of high performance and low power consumption, such as artificial intelligence inference, machine learning, data analytics, high-speed network communication, and high-end test and measurement equipment.

AGFC019R25A3I3E Core Features and Advantages

Exceptional Processing Performance

Logic Elements: 1,918,975 LEs, providing ample programmable resources

Processor System: Integrated quad-core 64-bit ARM Cortex-A53, with clock speeds up to 1.4GHz, supporting hard floating-point unit and ARM NEON technology

DSP Performance: Supports hard BFLOAT16 and compute performance up to 25 TFLOPS, meeting AI inference and high-performance DSP needs

High-Speed Connectivity Interfaces

Transceiver Performance: Supports data rates up to 28.9 Gbps NRZ and 57.8 Gbps PAM4

Hard IP for Protocols: Integrated PCIe Gen4 and 10/25/100G Ethernet hard IP, reducing power consumption and development complexity

Rich Interfaces: Supports EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG, and more

Efficient Memory System

On-Chip Memory: 256KB RAM

Embedded Memory: Up to 204Mb embedded memory

External Memory Support: DDR4 interface

Advanced Power Management

Based on Intel 10nm SuperFin process and 2nd Generation Hyperflex™ FPGA Architecture, it delivers up to 40% higher performance compared to previous generation high-end FPGAs, with 40% lower power consumption, providing superior energy efficiency for data center and edge computing applications.

AGFC019R25A3I3E Detailed Technical Specifications

AGFC019R25A3I3E Application Areas

The AGFC019R25A3I3E is the ideal choice for the following applications:

Artificial Intelligence & Machine Learning: Delivers efficient computing power for AI inference with 25 TFLOPS DSP performance and hard BFLOAT16 support

Data Center Acceleration: High-throughput transceivers and PCIe Gen4 support make it suitable for SmartNICs, computational storage, and hardware acceleration applications

Network Communication: Integrated 100G Ethernet hard IP, ideal for 5G infrastructure, core network equipment

High-End Test & Measurement: Abundant I/O resources and high-speed interfaces meet precision instrument requirements

Military & Aerospace: Wide operating temperature range (-40°C ~ 100°C) suitable for harsh environments

Why Choose AGFC019R25A3I3E

The AGFC019R25A3I3E represents the forefront of FPGA technology, perfectly combining a high-performance ARM processor system with a high-capacity FPGA fabric. Compared to traditional FPGA solutions, it can deliver up to 2x performance-per-watt improvement. Its highly integrated design reduces the need for external components, lowering system complexity and total cost of ownership.

For applications requiring high-performance computing, powerful DSP capabilities, and rich connectivity options, the AGFC019R25A3I3E provides a single-chip solution that significantly accelerates time-to-market, making it the ideal core processor for next-generation high-end embedded systems.