The AGFC019R31C2E1V is a high-performance representative of Intel's Agilex™ 7 FPGA F-Series, built using Intel's 10nm SuperFin technology. It integrates 1.9M logic elements and a quad-core ARM Cortex-A53 hard processor system, providing unparalleled computing performance and power efficiency for demanding application scenarios.
This FPGA utilizes Intel EMIB (Embedded Multi-die Interconnect Bridge) technology to achieve a configurable heterogeneous architecture within a single package, significantly accelerating time-to-market for various innovative solutions. Whether for communications infrastructure, data center acceleration, high-end test and measurement, or defense and medical systems, the AGFC019R31C2E1V delivers exceptional performance support.
Second-Generation Intel Hyperflex™ FPGA Architecture: Provides significant design optimization advantages, not only greatly improving performance but also reducing total power consumption, enhancing design functionality, and increasing designer productivity.
Operating speeds up to 1.4GHz: Ensures smooth performance and fast response when handling processing-intensive tasks.
The first FPGA to support enhanced half-precision floating-point (FP16) and BFLOAT16: Can deliver up to 38 TFLOPS of DSP performance (FP16), achieving significant improvement in performance per watt in AI and other compute-intensive applications.
1,354 DSP blocks: Support various processing formats including fixed-point, floating-point, multiplication, and multiply-accumulate, meeting various precision requirements.
Transceiver bandwidth up to 58 Gbps: Designed for high-speed interfaces, meeting the most demanding data transmission requirements.
480 user I/Os: Provides abundant interface resources, supporting multiple peripheral connections.
Hard Processor System: Integrates a quad-core 64-bit ARM Cortex-A53 with CoreSight™, ARM NEON, and Floating-Point Unit, enabling efficient hardware-software co-processing.
Rich peripheral support: Includes DMA, WDT, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, among others.
Dedicated Security Device Manager (SDM): Full control over configuration, authentication, bitstream encryption, and key protection.
Active tamper detection and response: Integrated tamper sensors ensure the security of sensitive data and applications.
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Parameter Category |
Specific Specifications |
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Logic Resources |
1,918,975 Logic Elements (LE), 650,500 Adaptive Logic Modules (ALM) |
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Memory Resources |
204 Mb maximum embedded memory, 256KB RAM |
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Processing System |
Quad-core ARM Cortex-A53 MPCore™, with CoreSight™ |
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DSP Resources |
1,354 DSP blocks |
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Transceiver Performance |
Up to 58 Gbps PAM4 data rate, 32 Gbps NRZ data rate |
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I/O Capability |
480 user I/Os, supporting 1.2V/1.8V LVCMOS, SSTL, POD, HSTL, and other I/O standards |
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Package Form |
3184-BFBGA(56x45) package |
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Operating Temperature |
0°C ~ 100°C (TJ) |
The AGFC019R31C2E1V FPGA is ideally suited for applications in the following fields:
Communications Infrastructure: 5G base stations, network functions virtualization, high-speed interface cards.
Data Center Acceleration: AI/Machine Learning inference, storage acceleration, network processing.
High-End Test & Measurement: Precision instruments, signal analysis, protocol testing.
Defense & Aerospace: Radar systems, signal intelligence, secure communications.
Medical Equipment: Medical imaging, diagnostic instruments, patient monitoring.
Broadcast & Video: Professional video switching, real-time encoding, visual effects processing.
The AGFC019R31C2E1V represents the pinnacle of current FPGA technology. It combines a high-performance logic architecture, hard processor system, advanced transceiver technology, and robust security features, providing customers with a comprehensive solution.
Supported by Intel oneAPI and Intel DevCloud, you can more easily develop and optimize applications for this FPGA, significantly shortening your product's time-to-market. Whether you prioritize ultimate performance, low power consumption, or require high integration, the AGFC019R31C2E1V meets your needs and provides ample room for future technology upgrades.
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