AGFC023R24C3E4X - High-Performance FPGA Empowering Next-Generation Innovative Designs

The AGFC023R24C3E4X is a high-performance FPGA based on Intel's advanced 10-nanometer process technology, designed to provide powerful hardware acceleration capabilities for various compute-intensive applications. Its exceptional performance and flexible configuration characteristics make it an ideal choice for artificial intelligence, high-speed communications, industrial automation, and other fields.

AGFC023R24C3E4X Product Highlights

Powerful Processing Capability: Equipped with 2.308 million logic elements and 246 Mb of embedded memory, delivering outstanding data processing performance.

High-Speed Connectivity: Supports transceiver rates up to 58 Gbps, meeting the most demanding data transmission requirements.

Advanced Integration: Integrates a quad-core ARM Cortex-A53 hard processor system, achieving the perfect combination of efficient computing and control.

Professional Security Protection: Built-in hardware encryption module and FPGA bitstream security features ensure system security and reliability.

AGFC023R24C3E4X Detailed Specifications

Core Architecture

The AGFC023R24C3E4X is manufactured using Intel's 10nm SuperFin process, combining the flexibility of FPGAs with the powerful computing capabilities of processors. This device provides 2,308,080 logic elements (LE) and 782,400 adaptive logic modules (ALM), capable of handling the most complex algorithms and data processing tasks.

Hard Processor System

Integrates a Quad-core 64-bit ARM Cortex-A53 MPCore processor, supporting 1.4GHz operating speed with CoreSight technology, ARM NEON, and floating-point units, enabling complete system functionality without an external processor.

Memory and DSP Resources

Embedded Memory: Up to 246 Mb

RAM Size: 256KB

DSP Blocks: 1,640 blocks supporting fixed-point (hard IP), floating-point (hard IP), multiplication, multiply-accumulate, and variable-precision operations

Connectivity and Interfaces

Transceiver Protocols: Integrated PCIe Gen4 and 10/25/50/100/200/400G Ethernet hard IP

External Memory Interfaces: Supports DDR4 and QDR IV

Connectivity Capabilities: Includes EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG, etc.

Physical Characteristics

Package: 2340-BFBGA Exposed Pad

Operating Temperature: 0°C ~ 100°C (TJ), suitable for industrial environment applications

I/O Count: 480 user I/Os

AGFC023R24C3E4X Application Areas

AGFC023R24C3E4X is an ideal choice for the following applications:

Artificial Intelligence and Machine Learning: With powerful DSP resources and floating-point computing capabilities, particularly suitable for AI inference and neural network acceleration

High-Speed Communication Systems: 58 Gbps transceiver performance perfectly matches 5G infrastructure and network equipment requirements

Military and Aerospace: Hardware encryption and security features ensure the security of mission-critical systems

Medical Imaging and Industrial Vision: High-performance computing capabilities meet real-time image processing requirements

Test and Measurement Equipment: Flexible programmable characteristics support multiple protocols and interfaces

Why Choose AGFC023R24C3E4X?

AGFC023R24C3E4X represents the latest advancement in FPGA technology, perfectly combining high performance, energy efficiency, and excellent integration. Whether for communication systems requiring high-speed data processing or industrial applications with strict real-time response requirements, AGFC023R24C3E4X can provide reliable solutions.

Its advanced 10nm process technology not only improves performance but also significantly reduces power consumption, helping you maintain a leading position in the competitive market.