AGFC023R25A3I3E – High-Performance Agilex F-Series FPGA SoC

AGFC023R25A3I3E Product Overview

The AGFC023R25A3I3E is a high-performance FPGA System-on-Chip (SoC) from Intel's advanced Agilex F-Series. Utilizing a 2581-FBGA package, this product combines the flexibility of FPGAs with the powerful computing capabilities of processors, delivering an industry-leading solution for high-performance computing, communication infrastructure, and high-end test and measurement applications.

AGFC023R25A3I3E Core Features

Powerful Processing Core: Integrates a quad-core ARM Cortex-A53 MPCore processor with CoreSight debug technology, ARM NEON SIMD instruction set, and floating-point unit, operating at up to 1.4GHz

High-Performance FPGA Architecture: Based on Intel's second-generation Hyperflex FPGA architecture, it provides up to 2.3 million logic elements of programmable resources to meet the most complex algorithm acceleration demands

Rich Connectivity Interfaces: Supports multiple industrial standard interfaces including EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, ensuring seamless connectivity with various peripherals

High-Speed Data Transfer: Features 480 I/O ports supporting high-speed data transfer, ideal for bandwidth-intensive applications

AGFC023R25A3I3E Performance Advantages

Exceptional Computing Performance: Combines the general-purpose processing power of ARM Cortex-A53 processors with the parallel computing advantages of FPGAs for comprehensive performance optimization

High Reliability: Operating temperature range of -40°C to 100°C junction temperature, suitable for industrial-grade and harsh environment applications

Efficient Architecture: Compared to previous-generation FPGAs, the Agilex 7 FPGA product family architecture delivers an average of 50% higher performance with up to 40% lower total power consumption

Advanced Technology Integration: Utilizes 10nm SuperFin and 7 technology to achieve the optimal balance between performance and power consumption

AGFC023R25A3I3E Application Areas

The AGFC023R25A3I3E is ideal for the following high-end applications:

Communication Infrastructure: 5G base stations, network function virtualization, high-speed switching equipment

High-Performance Computing: Data center acceleration, scientific computing, artificial intelligence inference

High-End Test and Measurement: Precision instruments, signal analysis systems

Military/Aerospace: Radar systems, signal intelligence, secure communications

Medical Electronics: Medical imaging, diagnostic equipment

AGFC023R25A3I3E Technological Innovations

Chiplet (SiP) Architecture: Employs system-in-package technology to integrate heterogeneous technologies into a single device, providing customized flexible solutions

3D Packaging Technology: Uses Embedded Multi-die Interconnect Bridge (EMIB) to integrate traditional FPGA fabric with dedicated semiconductor chiplets in a single package

High-Bandwidth Memory Support: Supports integrated in-package HBM2E memory options, delivering over 1 TBps memory bandwidth

Why Choose AGFC023R25A3I3E?

The AGFC023R25A3I3E represents the cutting edge of FPGA technology, perfectly combining processing performance, power efficiency, and connectivity. Whether for high-end applications demanding ultimate performance or embedded scenarios requiring low-power operation, this SoC delivers an exceptional solution. With its rich peripheral interfaces, powerful processing capabilities, and industrial-grade reliability, it is the ideal choice for various high-performance applications.