In an age where computing power defines competitiveness, the AGID023R18A1I1VC — Intel® Agilex™ 7 I-Series High-Performance SoC FPGA — is born to meet the most demanding data processing challenges. This chip is not merely a component; it is the core engine for building your next-generation networking, data center acceleration, and intelligent edge systems. It integrates powerful processing cores, ultra-high-speed connectivity, and programmable hardware acceleration capabilities, specifically optimized to break through performance bottlenecks in bandwidth-intensive applications.
Breakthrough Data Throughput: Integrates industry-leading high-speed transceivers, empowering you to effortlessly handle massive data streams.
Perfect Fusion of Hard-Core Processor and Programmable Logic: Achieves unparalleled system integration and design flexibility on a single chip.
Future-Oriented Technology Standards: Natively supports advanced protocols like PCIe Gen 5, CXL, and 400G Ethernet, protecting your long-term investment.
The heart of AGID023R18A1I1VC is a performance powerhouse. It features a built-in quad-core 64-bit ARM® Cortex®-A53 Hard Processor System (HPS) running at up to 1.4 GHz, handling complex control and management tasks. Simultaneously, its FPGA fabric provides up to 2.3 million Logic Elements (LEs) of programmable resources and 1,640 high-performance DSP blocks, designed specifically for parallel data stream processing, custom algorithm acceleration, and real-time signal processing, achieving extreme performance and energy efficiency ratios unattainable by software solutions.
This is one of the chip's most dazzling features. Its integrated transceivers support multiple advanced modes:
Data rates up to 116 Gbps with PAM4 modulation.
Support for up to 16 NRZ channels at 58 Gbps.
This enables it to directly drive cutting-edge interfaces like 400GbE Ethernet and PCI Express® Gen 5, meeting the extreme bandwidth demands for backplanes and front-end ports in high-end routers, switches, and compute acceleration cards.
The chip utilizes System-in-Package (SiP) technology, optionally integrating HBM2E high-bandwidth memory to deliver over 1 TBps of extreme memory bandwidth. Combined with hard-core support for external memory interfaces like DDR4 and QDR IV, it ensures massive data flows at high speed between the processor, acceleration units, and memory, fully unleashing computational potential.
To give you a clear understanding of its capabilities, we have summarized the core parameters below:
|
Technical Category |
Specification Parameters |
Description and Value |
|
Logic & Compute Resources |
Logic Elements (LE): 2,308,080 |
Provides massive programmable resources for implementing highly complex custom logic. |
|
|
Adaptive Logic Modules (ALM): 782,400 |
|
|
|
DSP Blocks: 1,640 |
Hard-accelerated for math-intensive operations (e.g., AI inference, image processing). |
|
Processing System |
Hard Processor: Quad-core ARM Cortex-A53 |
High-performance application processor running a full OS, responsible for system control. |
|
High-Speed Interfaces |
Maximum User I/O Count: 480 |
Abundant pin resources for connecting external sensors, memory, and various peripherals. |
|
|
High-Speed Transceivers: Up to 116 Gbps (PAM4) |
The physical foundation supporting ultra-high-speed networking and chip-to-chip interconnect. |
|
Protocol Support |
PCIe Gen 5, CXL, 400/200/100/50/25/10G Ethernet |
Hardened IP support reduces development difficulty and ensures optimal protocol performance. |
|
Package & Physical |
Package: 1805-BGA (42.5x42.5 mm) |
Compact package suitable for high-density board design. |
|
|
Operating Temperature: -40°C ~ 100°C (TJ) |
Wide-temperature design for demanding industrial and communications environments. |
The versatility of AGID023R18A1I1VC makes it an ideal choice for several cutting-edge fields:
Communications & Networking: As a core switching chip for building 5G/6G base stations, core network equipment, high-end routers, and 400G/800G optical transmission equipment.
Data Center Acceleration: For SmartNICs, computational storage appliances, AI training/inference accelerator cards, offloading CPU load and improving overall energy efficiency.
Test & Measurement: Building high-end protocol analyzers, wireless communication testers; its programmability allows quick adaptation to evolving standards.
Defense & Aerospace: With its high performance, high integration, and wide operating temperature range, it is suitable for critical mission systems like radar signal processing, electronic warfare, and satellite communications.
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