Intel® Agilex™ 7 FPGA AGID023R18A2E3VC: A Cutting-Edge Engine Empowering Bandwidth-Intensive Applications

In the face of data deluge and computing challenges, a high-performance chip integrating 2.3 million logic elements and a quad-core Arm processor is redefining the boundaries of networking, computing, and storage.

On the display page of an electronic components company in Futian District, Shenzhen, an Intel FPGA with the model number AGID023R18A2E3VC is placed in a prominent position. Packaged in FBGA-1805, it sits quietly on a tray, yet represents the forefront of current programmable logic devices.

Belonging to the Agilex™ 7 I-Series, this FPGA is born to meet the demands of the most challenging bandwidth-intensive applications. Built on Intel's advanced 10nm SuperFin process technology, it is not only a powerful programmable logic platform but also a complete heterogeneous computing system.

AGID023R18A2E3VC Product Overview & Core Highlights

The AGID023R18A2E3VC is a high-performance member of the Intel Agilex™ 7 FPGA family, perfectly combining the flexibility of hardware-programmable FPGA with the efficiency of a hardened processor system.

The chip was designed to address the growing data processing and transmission pressures in modern data centers, high-speed networks, and high-performance computing.

Its core advantage lies in providing industry-leading I/O interface performance, supporting transceiver speeds of up to 116 Gbps, and enabling high-speed, low-latency collaboration with processors through advanced interfaces like PCIe 5.0 and Compute Express Link (CXL).

Heterogeneous Integration: A single chip integrates large-scale FPGA logic (2.3M LEs) with a hardened quad-core Arm® Cortex®-A53 processor system, enabling hardware-software co-acceleration.

Cutting-Edge Process: Manufactured using Intel's 10nm SuperFin technology, delivering high performance while optimizing power consumption.

Forward-Looking Interfaces: Native support for PCIe 5.0 and CXL protocols, preparing for next-generation computing and memory architectures.

AGID023R18A2E3VC Breakthrough Performance Specifications

The technical specifications of the AGID023R18A2E3VC directly respond to the stringent requirements of high-performance application scenarios. Its logic density is as high as 2,308,080 Logic Elements (LEs), providing ample resources to implement complex customized hardware functions.

The device embeds rich hard IP cores, including 1,640 high-performance DSP blocks and up to 246 Mb of embedded memory, offering robust support for signal processing and large data buffering tasks.

The following is an overview of the key specifications for this model:

AGID023R18A2E3VC Core Features Designed for Future Challenges

The capabilities of the AGID023R18A2E3VC go far beyond a list of parameters. Each feature is designed to solve design challenges in specific fields.

For network acceleration, its transceivers up to 116 Gbps and hardened 200G encryption cores can process 400G Ethernet data streams losslessly and perform real-time AES-GCM encryption/decryption, safeguarding network security.

For data centers and heterogeneous computing, the integrated CXL support is key. It allows the FPGA to be recognized and invoked directly by the host processor as a cache and memory-coherent accelerator, greatly simplifying the programming model and improving data exchange efficiency. This is a crucial technology for breaking the "memory wall" bottleneck.

Its powerful processor subsystem (Quad-Core Cortex-A53, 1.4GHz) can independently run a full operating system or bare-metal programs, handling control-plane tasks and managing peripherals (such as Ethernet, USB OTG, I2C, etc.). This allows the FPGA logic resources to focus on high-speed data-plane processing, achieving true task division and collaboration.

AGID023R18A2E3VC Application Scenarios & Value Proposition

The capabilities of this FPGA determine where it can shine. It is a core component born to define next-generation infrastructure.

In wired communications and cloud networking, it can be used to build SmartNICs, switches, and traffic managers, enabling programmable Network Function Virtualization (NFV) and ultra-low-latency transaction processing.

In data centers, it serves as an efficient hardware accelerator for database query acceleration, video transcoding, genomics analysis, and financial risk modeling. Tightly integrated into servers via CXL and PCIe 5.0, it alleviates the CPU's burden.

In the test and measurement field, its high-performance analog/digital mixed-signal processing capabilities enable the creation of flexible, high-bandwidth test instruments to meet the R&D verification needs of cutting-edge technologies like 5G/6G and satellite communications.

Military, aerospace, and industrial automation also benefit from its wide operating temperature range, powerful real-time processing capabilities, and high design flexibility. It can be used for radar signal processing, flight control systems, and machine vision platforms.

AGID023R18A2E3VC Technical Specifications Summary

Model: AGID023R18A2E3VC

Family: Intel® Agilex™ 7 I-Series

Package: FBGA-1805

Logic Elements: 2,308,080 LEs

Processor: Quad-Core Arm® Cortex®-A53 @ 1.4GHz

High-Speed Transceivers: Up to 116 Gbps (PAM4), supporting PCIe 5.0, CXL, 400G Ethernet, and other protocols.

Number of User I/Os: 480

Operating Temperature: 0°C to 100°C (Junction Temperature)