
Break Performance Boundaries: Intel® Agilex™ 7 AGID023R18A2I2V FPGA, Powering the Core of Next-Generation High-Bandwidth Systems
In an era of data deluge and explosive computational demand, your next-generation communication, data center, and high-performance computing systems are calling for a more powerful and intelligent "heart." The Intel® Agilex™ 7 I-Series AGID023R18A2I2V FPGA answers this call. It is not merely a high-density programmable logic platform but a System-on-Chip (SoC) that integrates a hard processor system. Fabricated on industry-leading 10nm process technology, it is specifically designed to tackle the most demanding bandwidth-intensive applications, helping you seize the technological high ground and accelerate time-to-market.
The AGID023R18A2I2V converges multiple Intel cutting-edge technologies, with its core parameters directly addressing top-tier performance requirements:
|
Feature Category |
Key Parameter |
Specification |
|
Core Logic Resources |
Logic Elements (LEs) |
Up to 2,308,080 |
|
|
Adaptive Logic Modules (ALMs) |
782,400 |
|
Processing System |
Hard Processor System (HPS) |
Quad-Core 64-bit ARM® Cortex®-A53 |
|
|
Processor Speed |
Up to 1.4 GHz |
|
High-Speed Interfaces & Memory |
High-Speed Transceiver Rate |
Up to 58 Gbps (NRZ) / 116 Gbps (PAM4) |
|
|
Hard IP Protocol Support |
PCIe Gen5, 400G Ethernet, CXL |
|
|
Embedded Memory |
Up to 246 Mb |
|
Parallel Compute |
DSP Blocks |
1,640 blocks, supporting floating-point and fixed-point operations |
|
General I/O & Package |
User I/O Count |
Up to 480 |
|
|
Package Type |
1805-BGA |
|
Reliability & Security |
Operating Junction Temp (TJ) |
0°C to 100°C |
|
|
FPGA Bitstream Security |
Supported |
Perfect Fusion of Heterogeneous Computing & Hard-Core Acceleration
This product transcends traditional FPGAs by integrating a complete quad-core ARM Cortex-A53 Hard Processor System (SoC). This allows you to implement control-plane processing (handled by ARM cores) and data-plane acceleration (implemented by FPGA logic) on a single chip. This greatly simplifies board design, reduces component count, significantly lowers control latency, and provides an ideal platform for software-defined hardware.
Future-Ready High-Speed Interconnect Capability
To meet extreme bandwidth pressure in data centers, this device integrates high-speed transceivers supporting the latest protocols. It natively supports PCI Express 5.0, doubling interconnect bandwidth, and also incorporates forward-looking support for the Compute Express Link (CXL) protocol. This enables efficient, memory-coherent sharing between processors and accelerators, making it key for building disaggregated, scalable server architectures.
Powerful Compute for AI & Signal Processing
The built-in 1,640 high-precision DSP blocks are engines for parallel mathematical operations. Whether for 5G wireless communication Massive MIMO beamforming, radar signal processing, or matrix multiplication/convolutions in AI inference, these hard DSP resources deliver far superior energy efficiency and throughput compared to traditional processors.
Advanced Process & Robust Security Assurance
Utilizing Intel's 10nm SuperFin process technology, it enhances performance while optimizing power consumption. Furthermore, the device features a high-performance cryptography module and FPGA bitstream security, protecting configuration files and data in flight to ensure your intellectual property and system communications are secure, meeting the stringent requirements of critical infrastructure.
Next-Gen Communication Networks: As the core processing unit for 5G-Advanced and 6G base stations, perfectly handling high-bandwidth fronthaul/midhaul data and enabling flexible PHY layer function offload and acceleration.
High-Performance Computing & Data Centers: Used in SmartNICs, computational storage accelerators, and AI training/inference accelerator cards, offloading host CPU load via CXL and PCIe 5.0 to improve overall energy efficiency.
Test & Measurement Instruments: Leveraging its high logic density and programmability to serve as the core processing platform for complex test equipment like advanced protocol analyzers and wireless channel emulators.
Military & Aerospace Electronics: Performing high-speed signal processing and encrypted communications in radar and electronic warfare systems under harsh temperature conditions (0°C to 100°C junction temperature).
Choosing the Intel® Agilex™ 7 AGID023R18A2I2V means investing not only in a top-tier FPGA-SoC solution on the market today but also in technology for the years ahead. It integrates unparalleled logic capacity, a powerful hard processor system, industry-leading interconnect speeds, and military-grade security into a single device, providing a solid foundation for building products with long-term market competitiveness.
Infuse your innovative designs with the powerful momentum of Intel® Agilex™ 7 today, and together, let's define the next breakthrough for an intelligent world.
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