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AGID023R18A2I3EC

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  • MacroQuest Part#AGID023R18A2I3EC
  • ManufacturerIntel
  • Standard Lead TimeNA
  • Part StatusNA
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    Description FAQ Review
    Description

    The New Era of Heterogeneous Computing: Intel® Agilex™ 7 AGID023R18A2I3EC FPGA

     

    In an era defined by data deluge and exploding computational demands, cutting-edge hardware is not merely a tool but the key determinant of innovation speed and boundaries. The Intel® Agilex™ 7 I-Series FPGA is a flagship platform born to meet this very challenge. As a leading model within this series, the AGID023R18A2I3EC deeply integrates a high-performance FPGA fabric, a hardened processor system, and advanced interconnect interfaces. It is tailor-made for next-generation communications, data center acceleration, and embedded intelligent systems, empowering engineers to break through performance bottlenecks and rapidly transform future concepts into reality.

     

    AGID023R18A2I3EC Core Product Advantages: Heterogeneous Integration, Performance Leadership

    The AGID023R18A2I3EC represents the forefront of Intel's achievements in programmable logic devices. It is more than an FPGA; it is a highly integrated heterogeneous computing system designed to deliver unparalleled flexibility, energy efficiency, and throughput.

    Ultimate Core Performance: The device core is equipped with up to 2.3 million Logic Elements (LEs), providing a vast resource pool for user-defined logic. It also integrates 1,640 high-performance DSP blocks, optimized for complex signal processing, AI inference, and mathematical computation acceleration, supporting multiple precisions from fixed-point to floating-point.

    Hardened Processor System: Features a built-in quad-core 64-bit Arm® Cortex®-A53 Hard Processor System (HPS) with clock speeds up to 1.4 GHz. This design enables tight coupling between software tasks and hardware-accelerated logic, allowing the creation of complete SoC solutions without an external processor, simplifying system design and reducing latency.

    Industry-Leading Interconnect Interfaces: Supports PCI Express 5.0 and Compute Express Link (CXL) interfaces, enabling ultra-high-speed, low-latency connectivity to CPUs. Its transceiver performance is particularly outstanding, supporting data rates up to 116 Gbps PAM4, capable of directly driving ultra-high-bandwidth applications like 200G/400G Ethernet and 5G fronthaul.

    Built-in Security & Reliability: Incorporates a high-performance hardware cryptography module supporting algorithms like AES-GCM, providing line-rate protection for network traffic (MACsec) and data security. It also features advanced FPGA bitstream security to protect your intellectual property and system integrity.

     

    AGID023R18A2I3EC Application Scenarios: Empowering Innovation in Key Fields

    The powerful capabilities of the AGID023R18A2I3EC make it the ideal choice for several high-growth sectors:

    Communications & Networking: Serves as the main processor for core switch chips or line card processing, perfectly meeting the stringent bandwidth and protocol flexibility demands of 5G/6G base stations, core network routers, and 400GbE SmartNICs.

    Data Center & Cloud Computing: Used in hardware accelerator cards, it provides significantly better energy efficiency than general-purpose CPUs for workloads like AI/ML inference, video transcoding, database querying, and storage compression/encryption, while enabling efficient memory sharing with the host via CXL technology.

    High-Performance Embedded Computing: In mission-critical equipment such as radar signal processing systems, electronic warfare systems, and aerospace vehicles, its powerful real-time processing capability, abundant I/Os (up to 480 user I/Os), and wide operating temperature range (0°C to 100°C junction temperature) ensure reliable operation in harsh environments.

    Test & Measurement: Can be used to build next-generation high-end instrument platforms. Its programmable nature and high-speed interfaces allow rapid adaptation to new communication standards and test protocols, extending equipment lifecycle.

     

    AGID023R18A2I3EC Technical Specifications Overview

    For your quick evaluation, here is a summary of the core technical parameters for the AGID023R18A2I3EC:

    Feature Category

    Core Parameter

    Description & Value

    Core Fabric

    Logic Elements (LE)

    2,308,080

     

    Embedded Memory

    Up to 246 Mb

     

    DSP Blocks

    1,640

    Processor System

    Hard Processor

    Quad-core Arm® Cortex®-A53 MPCore™

     

    Processor Clock Speed

    Up to 1.4 GHz

    Interfaces & I/O

    Maximum User I/O Count

    480

     

    High-Speed Transceiver Rate

    Up to 116 Gbps (PAM4)

     

    Hardened Protocol Support

    PCIe Gen5, CXL, 400G Ethernet

    Security & Reliability

    Hardware Cryptography Module

    200G (Half-Duplex) Crypto Core

     

    FPGA Bitstream Security

    Yes

    Physical Characteristics

    Package Type

    FBGA-1805

     

    Operating Junction Temp (Tj)

    0°C to 100°C

     

    Why Choose the AGID023R18A2I3EC?

    Choosing the AGID023R18A2I3EC means you are selecting:

    A Future-Oriented Technology Platform: Based on Intel's 10nm process technology, offering generational advantages in performance, power, and integration.

    Reduced System Complexity & Cost: Single-chip integration of processor, FPGA, high-speed networking, and peripheral controllers significantly reduces board area, power consumption, and component count.

    Accelerated Time-to-Market: Leveraging the mature Intel Quartus® Prime design software, IP library, and reference designs can dramatically shorten development cycles for a faster response to market changes.

    Ongoing Investment Protection: Thanks to its exceptional programmability and forward-looking interface support, your design can be adapted via software updates to meet future needs, extending the hardware platform's lifecycle.

     

     

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