AGID023R31B1E2VC

Redefining Performance Boundaries: Intel® Agilex™ 7 SoC FPGA AGID023R31B1E2VC

In the era of data deluge and intelligent computing, the heart of a system demands unprecedented processing power, flexible hardware architecture, and extreme data throughput capabilities. The AGID023R31B1E2VC, a flagship System-on-Chip (SoC) solution within the Intel® Agilex™ 7 FPGA I-Series, is engineered precisely for this challenge. Integrating high-performance programmable logic, a robust hard processor system, and industry-leading transceiver technology, it is designed to accelerate next-generation communications infrastructure, high-performance computing, and real-time intelligent edge applications.

Core Advantages: Why Choose the AGID023R31B1E2VC?

Heterogeneous Computing, Hardware-Software Co-design
This device is not a simple FPGA but a highly integrated heterogeneous computing platform. It combines up to 2.3 million logic elements (LEs) of programmable hardware with a Quad-core 64-bit Arm® Cortex®-A53 hard processor system (HPS). This architecture allows developers to offload critical algorithms and data-plane processing tasks to the programmable logic for hardware-level acceleration, while the high-performance ARM cores run complex control-plane and application-layer software, achieving the perfect balance of performance and flexibility.

Extreme Data Throughput, Future-Ready Connectivity
The AGID023R31B1E2VC provides future-proof high-speed connectivity. It integrates up to 72 NRZ transceivers with data rates up to 58 Gbps, and 56 PAM4 transceivers supporting data transmission rates up to 116 Gbps. This enables native support for cutting-edge interface protocols like PCIe Gen 4/5 and 400G/800G Ethernet, effortlessly meeting the extreme bandwidth demands of applications such as data center interconnects, Network Function Virtualization (NFV), and financial high-frequency trading.

Coherent Interconnect for High-Performance Processors
Beyond traditional high-speed interfaces, a key highlight of this chip is its support for the Compute Express Link (CXL) interconnect technology. This allows the AGID023R31B1E2VC to establish cache and memory-coherent connections with high-performance processors like Intel® Xeon®, significantly reducing data exchange latency and enabling it to function as a highly efficient hardware accelerator or SmartNIC within heterogeneous computing systems, unlocking the full potential of the overall system.

High-Reliability Design and Comprehensive Security
Built on an advanced 10nm process technology, it delivers powerful computing performance while optimizing power efficiency. The device features built-in FPGA bitstream security and hard encryption blocks to ensure the protection of intellectual property and configuration data. Its operating junction temperature range meets industrial-grade requirements of 0°C to 100°C (TJ), and it utilizes a reliable 3184-BGA package, ensuring stable operation in various demanding environments.

AGID023R31B1E2VC Key Specifications at a Glance

AGID023R31B1E2VC Powering Diverse Innovations: Typical Application Scenarios

Next-Generation Communications & Networking: Serving as a core switching chip or line card to enable 800G optical transport, hardware acceleration for 5G Open RAN Distributed Units (DU) and Centralized Units (CU), and Smart Network Interface Cards (SmartNICs).

High-Performance Computing & AI Inference: Within the data center, connecting to host CPUs via CXL to act as a hardware acceleration unit for machine learning inference, video transcoding, database acceleration, or computational storage, improving performance-per-watt.

Advanced Embedded & Test Systems: Used for radar signal processing, Software-Defined Radio (SDR), high-end medical imaging, and prototyping or final products in aerospace and defense, where its powerful parallel processing capability is ideal for handling complex real-time algorithms.

The AGID023R31B1E2VC represents the cutting edge of programmable logic and heterogeneous system integration. It is more than a chip; it is the cornerstone for building your differentiated competitive advantage and accelerating time-to-market for your product.