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AGID023R31B1I2VB

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  • MacroQuest Part#AGID023R31B1I2VB
  • ManufacturerIntel
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  • Part StatusNA
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    Description FAQ Review
    Description

    Redefining Performance Boundaries: Intel® Agilex™ 7 FPGA I-Series AGID023R31B1I2VB

     

    In an era defined by data deluge and intelligent computing, tackling the most demanding bandwidth and processing challenges requires a powerful core. The Intel® Agilex™ 7 FPGA I-Series AGID023R31B1I2VB is engineered for this purpose. It is more than an advanced Field-Programmable Gate Array; it is a highly integrated System-on-Chip (SoC) solution that combines high performance, flexibility, and density. Built on industry-leading 10nm process technology, this product is specifically designed to meet the core demands of next-generation networks, data center acceleration, and high-performance computing applications, aiming to help your designs break through bottlenecks and lead innovation.

     

    AGID023R31B1I2VB Core Features Overview

    The table below summarizes the key technical specifications of the AGID023R31B1I2VB, allowing you to quickly grasp its powerful capabilities:

    Feature Category

    Key Parameter

    Specification & Description

    Core Processing Unit

    Hard Processor System (HPS)

    Integrated quad-core 64-bit Arm® Cortex®-A53 MPCore™, up to 1.4GHz, supporting CoreSight™, ARM NEON, and floating-point operations.

    FPGA Programmable Logic

    Logic Elements (LEs)

    Up to 2.3M logic elements, providing extremely rich programmable resources.

     

    Adaptive Logic Modules (ALMs)

    782,400, enabling highly flexible logic function design.

    High-Speed Signal Processing

    Digital Signal Processing (DSP) Blocks

    1,640 hard DSP blocks, supporting various high-precision operation modes like fixed-point, floating-point, and multiply-accumulate.

    Memory & Storage

    Maximum Embedded Memory

    Up to 246 Mb.

     

    On-Chip RAM

    256KB.

    High-Speed Transceiver Performance

    Max PAM4 Data Rate

    Industry-leading 116 Gbps, suitable for ultra-high-speed interconnects.

     

    Max NRZ Data Rate

    58 Gbps.

     

    PAM4 Transceiver Count

    Up to 56.

    Interface & Packaging

    User I/O Count

    Up to 480.

     

    Package Type

    3184-Ball BGA package, providing stable and reliable physical connectivity.

    Reliability & Security

    Operating Junction Temperature

    -40°C to 100°C, suitable for harsh industrial environments.

     

    FPGA Bitstream Security

    Supported, protecting design intellectual property.

     

    AGID023R31B1I2VB Five Key Technical Advantages, Defining Industry Benchmarks

    Top-Tier Data Throughput Capability
    Equipped with cutting-edge transceiver technology, supporting signal transmission rates of up to 116 Gbps PAM4. This enables the AGID023R31B1I2VB to effortlessly handle top-tier bandwidth requirements such as 400GbE Ethernet, optical transport networks, and high-performance computing interconnects, ensuring data pipelines never clog.

    The Powerful Heart of Heterogeneous Computing
    Featuring an innovative System-in-Package (SiP) architecture that tightly integrates a powerful quad-core Arm® Cortex®-A53 Hard Processor System with high-performance FPGA logic. This "CPU+FPGA" heterogeneous combination allows for efficient hardware acceleration on the FPGA while the Arm processors handle complex control tasks and operating systems, achieving the ultimate performance and power efficiency through software-hardware co-design.

    Future-Facing Protocols & Interconnects
    Built-in hard IP support for advanced protocols like PCIe Gen4 and CXL (Compute Express Link). The CXL interface, in particular, enables high-speed, low-latency cache and memory coherent connections with host processors, laying a solid foundation for building efficient heterogeneous computing systems and accelerating AI inference and data center workloads.

    Exceptional Signal Processing & Connectivity
    Integrates over 1,640 dedicated DSP blocks and up to 246 Mb of embedded memory, providing powerful real-time processing capabilities for complex algorithms such as radar beamforming, wireless communication, and image processing. Simultaneously, abundant user I/Os and LVDS support ensure seamless connectivity with various external sensors, memory, and interfaces.

    Robust Design Assurance
    Manufactured using an advanced 10nm process, balancing high performance with power efficiency. The product supports FPGA bitstream encryption to protect your core design assets. Its wide operating temperature range (-40°C ~ 100°C TJ) allows deployment in various demanding environments, from data centers to industrial automation.

     

    AGID023R31B1I2VB Wide Range of Applications

    Communications & Networking: Serves as a core switching chip or accelerator card for building 400G/800G routers, 5G base station fronthaul/midhaul, and SmartNICs.

    Data Center & Cloud Computing: Used for AI inference acceleration, database query acceleration, video transcoding, and memory/accelerator pooling enabled by CXL.

    Test & Measurement: Building high-performance test equipment for validating next-gen communication standards, satellite signals, or complex radar systems.

    Industrial & Medical: Enables machine vision, real-time motion control, and processing/reconstruction for high-end medical imaging (e.g., ultrasound, OCT).

    Military & Aerospace: Suitable for mission-critical systems like radar, electronic warfare, and satellite communication that require high-performance signal processing and reliability.

     

     

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    Q:Are all the parts new and original?
    -A:Yes, all parts are new and original checked by our quality control department.

    Q:How long is your warranty?
    -A:We offer a 1 year warranty for form fit and function for MacroQuest stock. 


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