EP4SGX110FF35I4G

Altera® Stratix® IV FPGAs deliver a breakthrough level of system bandwidth andpower efficiency for high-end applications, allowing you to innovate withoutcompromise. Stratix IV FPGAs are based on the Taiwan SemiconductorManufacturing Company (TSMC) 40-nm process technology and surpass all otherhigh-end FPGAs, with the highest logic density, most transceivers, and lowest powerrequirements.

The Stratix IV device family contains three optimized variants to meet differentapplication requirements:

■ Stratix IV E (Enhanced) FPGAs—up to 813,050 logic elements (LEs), 33,294 kilobits(Kb) RAM, and 1,288 18 x 18 bit multipliers

■ Stratix IV GX transceiver FPGAs—up to 531,200 LEs, 27,376 Kb RAM, 1,28818 x 18-bit multipliers, and 48 full-duplex clock data recovery (CDR)-basedtransceivers at up to 8.5 Gbps

■ Stratix IV GT—up to 531,200 LEs, 27,376 Kb RAM, 1,288 18 x 18-bit multipliers,and 48 full-duplex CDR-based transceivers at up to 11.3 Gbps

The complete Altera high-end solution includes the lowest risk, lowest total cost pathto volume using HardCopy® IV ASICs for all the family variants, a comprehensiveportfolio of application solutions customized for end-markets, and the industryleading Quartus® II software to increase productivity and performance.

For information about upcoming Stratix IV device features,Click Here.

Feature Summary:

The following list summarizes the Stratix IV device family features:

■ Up to 48 full-duplex CDR-based transceivers in Stratix IV GX and GT devicessupporting data rates up to 8.5 Gbps and 11.3 Gbps, respectively

■ Dedicated circuitry to support physical layer functionality for popular serialprotocols, such as PCI Express (PCIe) (PIPE) Gen1 and Gen2, Gbps Ethernet (GbE),Serial RapidIO, SONET/SDH, XAUI/HiGig, (OIF) CEI-6G, SD/HD/3G-SDI, FibreChannel, SFI-5, and Interlaken

■ Complete PCIe protocol solution with embedded PCIe hard IP blocks thatimplement PHY-MAC layer, Data Link layer, and Transaction layer functionality

■ Programmable transmitter pre-emphasis and receiver equalization circuitry tocompensate for frequency-dependent losses in the physical medium

■ Typical physical medium attachment (PMA) power consumption of 100 mW at3.125 Gbps and 135 mW at 6.375 Gbps per channel

■ 72,600 to 813,050 equivalent LEs per device

■ 7,370 to 33,294 Kb of enhanced TriMatrix memory consisting of three RAM blocksizes to implement true dual-port memory and FIFO buffers

■ High-speed digital signal processing (DSP) blocks configurable as 9 x 9-bit,12 x 12-bit, 18 x 18-bit, and 36 x 36-bit full-precision multipliers at up to 600 MHz

■ Up to 16 global clocks (GCLK), 88 regional clocks (RCLK), and 132 peripheryclocks (PCLK) per device

■ Programmable power technology that minimizes power while maximizing deviceperformance

■ Up to 1,120 user I/O pins arranged in 24 modular I/O banks that support a widerange of single-ended and differential I/O standards

■ Support for high-speed external memory interfaces including DDR, DDR2,DDR3 SDRAM, RLDRAM II, QDR II, and QDR II+ SRAM on up to 24 modularI/O banks

■ High-speed LVDS I/O support with serializer/deserializer (SERDES), dynamicphase alignment (DPA), and soft-CDR circuitry at data rates up to 1.6 Gbps

■ Support for source-synchronous bus standards, including SGMII, GbE, SPI-4Phase 2 (POS-PHY Level 4), SFI-4.1, XSBI, UTOPIA IV, NPSI, and CSIX-L1

■ Pinouts for Stratix IV E devices designed to allow migration of designs fromStratix III to Stratix IV E with minimal PCB impact