
SAMSUNG K4A4G165WF-BCTD 4Gb F-die x16 DDR4 SDRAM
SAMSUNG K4A4G165WF-BCTD Product Overview
The K4A4G165WF-BCTD is a 4Gb DDR4 SDRAM component from Samsung Semiconductor, part of the K4A4G165WF F-die series, designed for high-performance memory applications requiring fast data transfer and low power consumption. The device adheres to the JEDEC DDR4 standard and operates at 1.2V, delivering significant power savings compared to previous DDR3 generations .
Organized as 256M x 16 bits in a 96-ball FBGA package measuring 13.30 x 7.50 mm, the device supports a maximum data rate of 2666 Mbps (DDR4-2666) with an I/O clock frequency of 1333 MHz . The device features 8n-bit prefetch architecture with four bank groups and sixteen banks for efficient parallel access . Operating temperature range is 0C to +95C for commercial applications . The device is RoHS and halogen-free compliant, with an active lifecycle status .
SAMSUNG K4A4G165WF-BCTD Key Specifications
|
Parameter |
Value |
|
Manufacturer |
Samsung Semiconductor |
|
Memory Type |
DDR4 SDRAM (F-die) |
|
Density |
4 Gb (256M x 16) |
|
Data Rate |
2666 Mbps (DDR4-2666) |
|
Clock Frequency |
1333 MHz |
|
Supply Voltage |
1.2V (1.14V to 1.26V) |
|
Package |
96-ball FBGA (13.30 x 7.50 x 1.10 mm) |
|
Organization |
4 Bank Groups, 16 Banks |
|
Prefetch |
8n Architecture |
|
Operating Temp (TA) |
0C to +95C |
|
Storage Temp |
-55C to +100C |
|
Mounting |
Surface Mount |
|
RoHS |
Compliant / Halogen Free |
|
Part Status |
Active |
SAMSUNG K4A4G165WF-BCTD Key Advantages
The K4A4G165WF-BCTD employs Samsung's advanced DDR4 technology, delivering 2666 Mbps data rates while operating at 1.2V for reduced power consumption compared to DDR3 and DDR3L devices. The 256M x 16 organization provides efficient memory density in a compact FBGA package, with a 16-bit data bus balancing performance and I/O pin efficiency.
The device supports 8n-bit prefetch architecture and programmable burst lengths for optimized data throughput. The four bank group architecture enables faster access to different memory regions by allowing transfers to different bank groups to be completed more rapidly . The 0C to +95C commercial temperature range ensures reliable operation in standard operating environments. As a F-die DDR4 product, this device represents Samsung's continued innovation in memory technology .
SAMSUNG K4A4G165WF-BCTD Typical Applications
Server and data center memory modules
AI and machine learning accelerator cards
5G communication and networking equipment
High-performance computing systems
PC and gaming system memory
Laptops and portable devices
Embedded system memory
Network routers and packet buffer memory
Why Choose the SAMSUNG K4A4G165WF-BCTD?
The K4A4G165WF-BCTD combines 4Gb density, 2666 Mbps data rate, and 1.2V low-voltage operation in a compact 96-ball FBGA package from Samsung Semiconductor, a global leader in memory solutions. It delivers stable, reliable, and power-efficient memory for commercial applications where high-speed data transfer and low power consumption are critical. The device is manufactured by Samsung Electro-Mechanics and maintains an active lifecycle status, ensuring long-term availability for production designs . The DDR4 technology provides an ideal balance of performance and power efficiency, making it a versatile solution for a wide range of memory-intensive applications .
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