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STM32WB55REV6

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  • MacroQuest Part#STM32WB55REV6
  • ManufacturerSTMicroelectronics
  • Standard Lead TimeNA
  • Part StatusActive
  • $0.00
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    Description FAQ Review
    Description

    STM32WB55REV6 STM32WB Series Multiprotocol Wireless 32-Bit MCU


    64MHz Cortex-M4 x Dual-Core Architecture — Ultra-Low-Power Bluetooth LE 5.3 and 802.15.4 Connectivity

     

    STM32WB55REV6 Product Overview

    The STM32WB55REV6 is a multiprotocol wireless 32-bit MCU from STMicroelectronics' STM32WB Series, designed for the electronic measurement and control of industrial and consumer applications with integrated 2.4 GHz RF connectivity. The REV6 variant features a dual-core architecture combining a high-performance Arm® Cortex®-M4 application processor with an ultra-low-power Arm® Cortex®-M0+ dedicated to real-time radio layer operations, enabling concurrent protocol handling.

    Rated for a 64 MHz application core frequency with a 32 MHz radio core, it supports RF standards including Bluetooth® Low Energy 5.3IEEE 802.15.4Thread, and Zigbee®. It outputs digital signals through 49 GPIOs and multiple serial interfaces, with 512 KB Flash and 256 KB SRAM memory. Supply voltage ranges from 1.71 V to 3.6 V. Mass is approximately 0.009 g (device only) and operating temperature ranges from -40°C to +85°C. The RF receiver sensitivity is -96 dBm (Bluetooth LE 1 Mbps) and -100 dBm (802.15.4), with programmable output power up to +6 dBm.

     

    STM32WB55REV6 Key Specifications

    Parameter

    Value

    Application core

    Arm® Cortex®-M4 with FPU, 64 MHz

    Radio core

    Arm® Cortex®-M0+, 32 MHz

    Flash memory

    512 KB

    SRAM

    256 KB

    RF standards

    Bluetooth® LE 5.3, 802.15.4, Thread, Zigbee®

    Output power

    +6 dBm max (programmable)

    RX sensitivity

    -96 dBm (BLE 1 Mbps) / -100 dBm (802.15.4)

    Supply voltage (VC)

    1.71 V to 3.6 V

    GPIO count

    49

    Serial interfaces

    I2C, SPI, USART, LPUART, USB, SAI

    ADC

    12-bit, 16 channels

    Operating temp (TA)

    -40°C to +85°C

    Package

    VFQFPN-68 (8x8 mm)

     

    STM32WB55REV6 Key Advantages

    The STM32WB55REV6 employs a dual-core architecture with an integrated balun and 2.4 GHz RF transceiver, delivering robust wireless connectivity while the dedicated Cortex-M0+ core handles real-time low-layer operations, freeing the Cortex-M4 for application processing. The 512 KB Flash and 256 KB SRAM provide ample resources for complex protocol stacks and application code, while the ultra-low-power platform with 13 nA shutdown mode and active-mode MCU consumption under 53 µA/MHz enables battery-powered designs. The 68-pin VFQFPN package accommodates compact PCB layouts and the 49 GPIOs support extensive peripheral interfacing. The AES-256 hardware encryptionhardware PKA, and true random number generator ensure robust security for secure firmware installation and data protection.

     

    STM32WB55REV6 Typical Applications

    Industrial sensors and actuators requiring wireless connectivity
    Building automation and smart home devices
    Wearable health monitors and fitness trackers
    Beacons and asset tracking systems
    Smart meters and energy monitoring devices
    Wireless human interface devices and game controllers

     

    Why Choose the STM32WB55REV6?

    The STM32WB55REV6 combines 64 MHz Cortex-M4 processing512 KB Flashdual-core architecture, and multiprotocol 2.4 GHz wireless in a compact 68-pin VFQFPN package. Manufactured by STMicroelectronics, it delivers stable, secure, and ultra-low-power wireless connectivity for IoT and industrial applications. The integrated balun and dedicated radio core offer the distinct advantage of reduced BOM costs and simplified RF design, while the concurrent protocol support enables seamless migration between Bluetooth LE and 802.15.4-based stacks.

     

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